Welcome to ISMC2024!
The 4th International Symposium on Emerging Memory and Computing (ISMC), is scheduled to take place in Hong Kong on January 9-11, 2024! Our journey began with the 1st Symposium held at the Hong Kong Polytechnic University from September 22-24, 2017. Building on its success, the 2nd Symposium was hosted in Ji'an City, Jiangxi Province, from August 31 to September 1, 2018, followed by the 3rd Symposium held online and hosted by the Hong Kong Polytechnic University from May 26-29, 2021. This highly anticipated international symposium will bring together distinguished researchers, engineers, and experts from across the globe to exchange their latest findings and insights in the rapidly evolving field of emerging memory and computing.
With the rise of big data, artificial intelligence, and other data-intensive applications, there is an urgent need for new memory and computing technologies that can keep pace with the growing demands of modern computing. Emerging memory and computing technologies, such as resistive random-access memory (RRAM), spin-transfer torque random-access memory (STT-RAM), ferroelectric random-access memory (Fe-RAM), phase-change memory (PCM), and organic/molecule memory, are promising candidates for meeting these challenges, offering high density, low power consumption, and fast access times.
The upcoming symposium serves as an exceptional platform for researchers and engineers to engage in meaningful exchanges of ideas and explore the forefront of emerging memory and computing. Esteemed speakers and thought leaders from various corners of the world will come together to address a diverse range of pivotal themes, encompassing memory technology, computing architecture, machine learning algorithms, and emerging applications. While the symposium covers a broad spectrum of subjects, including non-volatile memory, neuromorphic computing, in-memory computing, in-sensor computing, and machine learning applications, it also welcomes contributions on related topics of interest.
The symposium in 2024 will also feature a special session dedicated to the Special Issue of Advanced Materials on Neuromorphic Engineering (https://onlinelibrary.wiley.com/toc/15214095/2023/35/37), for which internationally renowned researchers have just published their cutting-edge findings and will be invited to present them in the symposium. To amplify the visibility and impact of ISMC 2024, Wiley is committed to promoting the event through its influential channels with wide-reaching announcements via web banner ads, social media posts, WeChat, and the Researcher App, ensuring that this symposium garners global recognition.
We hope that this symposium will foster collaboration and innovation in the field of emerging memory and computing, and we look forward to welcoming you to Hong Kong for what promises to be an exciting and productive event.
Organizing Committee
General Chair
Prof. Yang Chai, The Hong Kong Polytechnic University
Co-Chairs
Prof. Feng Miao, Nanjing University
Prof. Ilia Valov, RWTH-Aachen
Committee
Prof. Kah-Wee Ang, National University of Singapore
Prof. Jeehwan Kim, Massachusetts Institute of Technology
Prof. Han Wang, The University of Hong Kong
Prof. Yuchao Yang, Peking University
Contact Us
Prof. Yang Chai
Email: y.chai@polyu.edu.hk
Mr Yan Weicheng
Email: weicheng.yan@connect.polyu.hk
Sponsors
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